
Taipei , Taipei , Taiwan. 






TRI TR7700 SIII 3D AOI Inspection Machine – 2018 Model – 13 Units Available TRI TR7700 SIII 3D AOI Inspection Machine – 2017 Model – 2 Unit...
| Brand | TRI (Test Research Inc., Taiwan) |
| Model Number | TR7700 SIII 3D |
| Machine Type | Used Machine (8 years 8 months 21 days) |
| Category | General |
| Subcategory | OTHER |
| Location | Zhongshan, Guangdong, China |
| Manufacturing Year | 2018 |
| Country of Origin | Taiwan |
| Power Source | Electric |
| Weight | 500 KG |
| Material Type | Steel |
| Automation Grade | Fully Automatic |
| Motor Power | AC Motor |
| Specifications | Used TRI TR7700 SIII 3D Automated Optical Inspection (AOI) machines for SMT/PCB assembly inspection, offering high-resolution 2D and 3D inspection capabilities for reliable detection of component and soldering defects. Brand: TRI (Test Research, Inc.) Model: TR7700 SIII 3D Equipment Type: In-line 2D/3D Automated Optical Inspection (AOI) System Quantity: 15 units Year of Manufacture: 13 units – 2018; 2 units – 2017 Top View Camera: 4 Mpix high-speed color camera Lighting: Multi-phase RGB+W LED Optical Resolution: 10 µm or 15 µm (factory setting) 3D Technology: Single/Dual 3D laser sensors Imaging Method: Dynamic imaging with true 3D profile measurement Inspection: Pre- and post-reflow PCB inspection Typical Defects: Missing/shifted/rotated components, tombstoning, polarity, solder bridging, insufficient/excess solder and other assembly defects |
| Usage / Application | This TRI TR7700 SIII 3D-AOI is an in-line automated optical inspection system for SMT electronics manufacturing. It performs post-reflow 2D & 3D inspection on printed circuit boards, detecting solder joint quality and component assembly defects. Widely applied in SMT assembly factories, EMS contract manufacturers, consumer electronics, automotive electronics, communication hardware and industrial PCB production lines. Capable of inspecting miniature components down to 01005 size, supporting quality control, defect traceability and SPC yield analysis for mass-production PCB assemblies. |
| Listed On | 28/08/2026 |

Semiconductor
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Dominic Ong
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